Best Tutorial on PCB Layout Placement Review Checklist

In this tutorial, we are going to PCB Layout Placement Review Checklist.

  • Basic Guideline –
  • All parts are placed.
  • Placement service to minimize layer count.
  • Placement service to minimize board size if appropriate.
  • Prefer components oriented in same direction (PIN1 always should be in same direction.
  • Connector Placement Guideline –
  • Connector position, orientation reviewed against mechanical drawing.
  • Connector correct side of board.
  • Connector pinout verified in PCB software against connector specs.
  • Connector pinout and type mechanically compared with those of physically mating connectors.
  • Check connector compatibility with board thickness.
  • EMI requirements with power connectors taken into consideration.
  • Components Placement Guideline –
  • Pin out of high pin count, newly created parts verified in PCB layout software against part specs and actual part names.
  • Sockets pin1 orientation is correct and proper (for ICE or ROM emulator).
  • Physical dimensions of such parts verified.
  • Pad location and pad stacks (solder paste, drill and keep out) of such parts verified.
  • Pin assignment of FPGA verified against placed and routed FPGA design.
  • Polarization label built in to silkscreen for polarized capacitors, diodes, and integrated circuits, label is visible after stuffing for ease of inspection.
  •  Bypass capacitors positioned well compared to the devices on the board.
  • Required clearance around through hole parts area on bottom side.
  • Required clearance around BGA part to allow for rework nozzle.
  •  Clearance between capacitors and resistors.
  • Component pad to pad spacing required for rework, placement and test.
  • Trace keep out built into pad stacks of non – plated through holes.
  • Crystal Placement Guideline –
  • Crystal and capacitors placed close to microprocessor and DSP.
  • Mechanical Placement Guideline –  
  • Position of LED’s switches, front panel connectors reviewed against mechanical drawing of board and front panel (x, y and z dimensions)
  • Board dimensions match mechanical drawing, including board thickness.
  • Connector and heat sink mounting hole sizes and pad clearance verified against component and mounting hardware specifications.
  • Mechanical mounting holes (like stiffener) match mechanical drawing.
  • Connector and standoff location match those of mating boards.
  • All heat sinks pointed in the appropriated direction for air – flow.
  • No components are too small.
  •  Mechanical drawing reflects all mechanical parts (I/O panels, screws, tooling holes, etc.).
  •  Fiducially verified.
  • Tooling hole size specified.
  • Define hole size specified.
  • Define break – ways and penalization.
  • DDR2/DDR3 Placement Guideline –
  • Place DDR devices with maximum distance from DSP.

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