Best Tutorial on Pre Layout Review Checklist

In this tutorial, we are going to learn about pre layout checklist.

  • Previous Review-
  • Schematic design review conducted. All action items taken care of.
  • Net list review conducted.
  •  BOM review conducted.
  • Design function-
  • JTAG circuit has reviewed and simulated.
  • System level simulation and component level simulation reviewed.
  • Bypass capacitance reviewed.
  • Design meets test requirement on all power supplies analyzed.
  • Deviations from specification area understood/approved by management /marketing /software            
  • If subsequent revision, compare netlist against previous netlist and explain changes made.
  • If subsequent revision, changes have been modeled in real hardware.
  • Conformance to mechanical requirements reviewed, including stiffing, component height clearance, and card edge clearance.
  • Design data integrity-
  • Symbols in golden library.
  • Connector pin outs verified against pin outs of daughter/mother card.
  • Device pin outs have been verified against spec sheet.
  • Power /ground connection verified.
  • No package errors, package warning, over sights explained.
  • All single-node nets checked and explained.
  • Archive checked in and verified.
  • Layout guidelines-
  • Mechanical layout constraints (e.g. outline, maintaining hole locations, keep outs, height restrictions, stiffener, etc.) established.
  •  Preliminary stack-up (layer assignment) established.
  • Preliminary fabrication design rules established (e.g. trace width, trace spacing, ZO)
  • Fabrication design rules sanity-checked and pre-quoted with PCB vendor to assess manufacturability, cost.
  • Preliminary floor- plan defined.
  •  Critical nets and corresponding layout rules defined.
  •  No critical nets have unknown signal names.
  •  Analog power supply and signal names.
  • If application, board size efficiently uses available panel size.
  •  Specify ICT requirements for layout (e.g. via-per-net accessibility.
  • DFM ( DESIGN FOR MANUFACTURING)-
  • Distinct pull-ups/pull-downs for multiple pins on the same part, if possible.
  • Disable un-used inputs on large parts, e.g.FPGA’s, custom chips.
  • Boundary scans on complex parts, e.g.FPGA, custom chips.
  • Single –ended and differential clocks are controllable.
  • Test points in design for all power supplies.
  • DESIGN FOR EMI(ELECTROMAGNETIC INTERFERENCE)-
  • Heat sinks grounded, as appropriate.
  • Requirements for gasket assessed and designed in if needed.
  • Card guide grounding provision is designed in if needed.
  • Mechanical-
  • Mechanical drawing developed for board outline.
  • Layout symbol for board developed from mechanical drawing, including mounting holes, interface connector locations, hardware keep outs, guide keep outs, mezzanine board provision, and tooling holes.
  • Thermal Design-
  • Board thermally modeled per predicted air flow conditions.
  •  Heat sink has adequate clearance.
  •  Heat sink mounting details fully hashed out.
  • Heat sink, mounting hardware, and thermal interface materials have PNR’s (part number request) and are on order.

Leave a Comment